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Semiconductor Packaging
Low-Cost Chiplet Packaging for HPC, AI, and Automotive Applications
Nokibul Islam
Sr. Director, FAE
STATSChipPAC [SHA: 600584]
Rapidly Moving Market of Semiconductor Packaging
Cherie Sasan
Head of Design and Development, Power Module Technology, Integrated Micro- Electronics
Integrated Micro- Electronics [PSE: IMI]
ON THE DECK
The Pendulum in Our Industry Again Strikes Maximum
Philipp Molendo, Vice President Purchasing Electronics
BSH Home Appliances Group
Navigating Complexity: The Unsung Heroes Within
Rory Hepner, Directory Global Vehicle Logistics and Customs Operations
Mercedes-Benz (ETR: MBG)
Unit-Level Traceability for Automotive Customers
Dr. Ajay Sattu, Sr. Manager, Automotive Strategic Marketing
Amkor Technology, Inc
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